BONDING TECHNOLOGY LIMITED

BONDING TECHNOLOGY LIMITED was incorporated as a Private Company Limited by Shares in Hong Kong on May 18,1990. Status:Dissolved.

• Register Number: 0278452
• Chinese Name: 佳銘電子實業有限公司
• English Name: BONDING TECHNOLOGY LIMITED
• Date of Establishment: May 18,1990
• Cancellation Date: Unavailable
• Company Category: Private Company Limited by Shares
• Active Status: Dissolved

• Register of Charges: UnavailableUnavailable
• Name of History: 1992年8月20日
  BONDING TECHNOLOGY LIMITED
  佳銘電子實業有限公司
  1991年2月7日
  BONDING TECHNOLOGY LIMITED
  佳銘電子貿易有限公司
  1990年5月18日
  BONDING TECHNOLOGY LIMITED

According to sections 107 and 109 of the Hong Kong Companies Ordinance, all companies are required to submit returns in a specified format to the Registrar of Companies every year. The content includes: Hong Kong company business registration annual fee renewal, annual return filing fee, employee salaries tax declaration, and Hong Kong company's registered address and legal secretary's review in the following year. Hong Kong company annual review time: 42 days from the anniversary of the establishment of the corporation.