BONDS TECHNOLOGY LIMITED

BONDS TECHNOLOGY LIMITED was incorporated as a Private Company Limited by Shares in Hong Kong on September 26,2003. Status:Dissolved.

• Register Number: 0863313
• Chinese Name: 邦時科技有限公司
• English Name: BONDS TECHNOLOGY LIMITED
• Date of Establishment: September 26,2003
• Cancellation Date: November 06,2015
• Company Category: Private Company Limited by Shares
• Active Status: Dissolved

• Register of Charges: UnavailableUnavailable
• Name of History: 2003年9月26日
  BONDS TECHNOLOGY LIMITED
  邦時科技有限公司

According to sections 107 and 109 of the Hong Kong Companies Ordinance, all companies are required to submit returns in a specified format to the Registrar of Companies every year. The content includes: Hong Kong company business registration annual fee renewal, annual return filing fee, employee salaries tax declaration, and Hong Kong company's registered address and legal secretary's review in the following year. Hong Kong company annual review time: 42 days from the anniversary of the establishment of the corporation.