BOND TECH (HONG KONG) LIMITED

BOND TECH (HONG KONG) LIMITED was incorporated as a Private Company Limited by Shares in Hong Kong on July 10,2002. Status:Dissolved.

• Register Number: 0805605
• Chinese Name: 邦得(香港)有限公司
• English Name: BOND TECH (HONG KONG) LIMITED
• Date of Establishment: July 10,2002
• Cancellation Date: January 10,2014
• Company Category: Private Company Limited by Shares
• Active Status: Dissolved

• Register of Charges: UnavailableUnavailable
• Name of History: 2002年7月10日
  BOND TECH (HONG KONG) LIMITED
  邦得(香港)有限公司

According to sections 107 and 109 of the Hong Kong Companies Ordinance, all companies are required to submit returns in a specified format to the Registrar of Companies every year. The content includes: Hong Kong company business registration annual fee renewal, annual return filing fee, employee salaries tax declaration, and Hong Kong company's registered address and legal secretary's review in the following year. Hong Kong company annual review time: 42 days from the anniversary of the establishment of the corporation.