YICK BOND TECHNOLOGIES LIMITED

YICK BOND TECHNOLOGIES LIMITED was incorporated as a Private Company Limited by Shares in Hong Kong on April 26,2013. Status:Dissolved.

• Register Number: 1898471
• Chinese Name: 益邦科技有限公司
• English Name: YICK BOND TECHNOLOGIES LIMITED
• Date of Establishment: April 26,2013
• Cancellation Date: September 23,2016
• Company Category: Private Company Limited by Shares
• Active Status: Dissolved

• Register of Charges: UnavailableUnavailable
• Name of History: 2013年4月26日
  YICK BOND TECHNOLOGIES LIMITED
  益邦科技有限公司
• Administrative Division: Kwai Tsing
• Sub District: Kwai Chung
• Street: Tai Lin Pai Road

According to sections 107 and 109 of the Hong Kong Companies Ordinance, all companies are required to submit returns in a specified format to the Registrar of Companies every year. The content includes: Hong Kong company business registration annual fee renewal, annual return filing fee, employee salaries tax declaration, and Hong Kong company's registered address and legal secretary's review in the following year. Hong Kong company annual review time: 42 days from the anniversary of the establishment of the corporation.