BONDSEMI TECHNOLOGY LIMITED

BONDSEMI TECHNOLOGY LIMITED was incorporated as a Private Company Limited by Shares in Hong Kong on May 26,2010. Status:Dissolved.

• Register Number: 1460759
• Chinese Name: 振邦微科技有限公司
• English Name: BONDSEMI TECHNOLOGY LIMITED
• Date of Establishment: May 26,2010
• Cancellation Date: July 17,2015
• Company Category: Private Company Limited by Shares
• Active Status: Dissolved

• Register of Charges: UnavailableUnavailable
• Name of History: 2010年5月26日
  BONDSEMI TECHNOLOGY LIMITED
  振邦微科技有限公司
• Administrative Division: Wan Chai
• Sub District: Wan Chai
• Street: Hennessy Road

According to sections 107 and 109 of the Hong Kong Companies Ordinance, all companies are required to submit returns in a specified format to the Registrar of Companies every year. The content includes: Hong Kong company business registration annual fee renewal, annual return filing fee, employee salaries tax declaration, and Hong Kong company's registered address and legal secretary's review in the following year. Hong Kong company annual review time: 42 days from the anniversary of the establishment of the corporation.