GOLD BOND ENGINEERING MATERIALS LIMITED

GOLD BOND ENGINEERING MATERIALS LIMITED was incorporated as a Private Company Limited by Shares in Hong Kong on July 29,2006. Status:Dissolved.

Infomation

  • Register Number: 1063221
  • Chinese Name: 金邦工程物料有限公司
  • English Name: GOLD BOND ENGINEERING MATERIALS LIMITED
  • Date of Establishment: July 29,2006
  • Cancellation Date: June 23,2017
  • Company Category: Private Company Limited by Shares
  • Active Status: Dissolved

More Information

  • Register of Charges: UnavailableUnavailable
  • Name of History: 2006年7月29日
    GOLD BOND ENGINEERING MATERIALS LIMITED
    金邦工程物料有限公司
  • Administrative Division: Kwai Tsing
  • Sub District: Kwai Chung
  • Street: Container Port Road

Annual Review Time

According to sections 107 and 109 of the Hong Kong Companies Ordinance, all companies are required to submit returns in a specified format to the Registrar of Companies every year. The content includes: Hong Kong company business registration annual fee renewal, annual return filing fee, employee salaries tax declaration, and Hong Kong company's registered address and legal secretary's review in the following year. Hong Kong company annual review time: 42 days from the anniversary of the establishment of the corporation.

  • Annual Review Year
  • Start Time
  • End Time
  • 2024
  • 2024/29/07
  • 2024/08/09
  • 2025
  • 2025/29/07
  • 2025/08/09

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